Overview of Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate

Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate is advanced ceramic components made from high-purity aluminum oxide (Al₂O₃), known for their exceptional hardness, thermal stability, and corrosion resistance. These plates are widely used in demanding industries such as electronics, aerospace, semiconductor manufacturing, and high-temperature furnace applications due to their superior electrical insulation and wear-resistant properties.

Key Features of Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate

High Thermal Resistance ：Withstands extreme temperatures up to 1600°C.

Excellent Electrical Insulation：Ideal for electronic substrates & insulators.

Superior Mechanical Strength：High hardness & wear resistance for long-lasting performance.

Chemical & Corrosion Resistance：Resists acids, alkalis, and harsh environments.

Customizable：Available in various sizes, thicknesses, and purity levels (96%-99.9%).

(Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate)

Specification of Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate

This Au Layer ALN Ceramic Plate features copper plating. It’s developed for demanding electronic devices requiring leading heat control. The base is Aluminum Nitride ceramic. ALN ceramic actions warm away really quickly. It beats regular alumina ceramic easily. Warmth spurts quickly. This maintains your parts cooler. Cooler components last much longer and function much better.

The copper layer is adhered straight onto the ALN. This copper layer is thick and strong. It offers exceptional electric courses. You can engrave circuits onto it. You can likewise solder parts straight onto the copper. The bond between copper and ceramic is strong. It won’t peel off under stress.

A thin gold layer covers the copper. This gold finish safeguards the copper. It stops the copper from rusting or tainting. Gold also makes soldering easier and extra trustworthy. Links stay strong with time. The surface area remains tidy for wire bonding also.

This plate handles heats easily. It doesn’t warp or split with warmth adjustments. The ceramic base is a strong electrical insulator. Electrical energy moves only where you desire it, via the copper circuits. This prevents shorts and signal issues. It’s tough things.

Use this plate for high-power LED modules. It works well in laser diode bundles. RF and microwave circuits need its stable base. Power semiconductor gadgets count on it. Anywhere warmth build-up injures performance, this plate assists. It relocates warm fast, brings current, and stays reliable. Great for innovative motherboard needing leading warmth spreading.

(Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate)

Applications of Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate

Gold-coated aluminum nitride ceramic plates with copper bases fix tough warmth problems in electronics. Warmth accumulates fast in effective tools. It harms components. This plate relocates heat away effectively. The aluminum nitride core is crucial. It shields electrically but performs warm very well. Copper spreads warmth rapidly throughout the surface. The thin gold layer on the top does important tasks.

Gold stops corrosion. Electronics face dampness and chemicals. Gold safeguards the copper below. Gold also makes soldering easy and trustworthy. Parts connect strongly. Links remain strong with time. This matters for essential systems. Gold provides a smooth, secure surface area. Electrical signals flow easily. Signal sound reduces. Performance improves.

These plates are important for high-power usages. Think laser diodes generating intense light. Assume insulated gateway bipolar transistors (IGBTs) in electric motor drives. Assume power modules controlling electrical energy flow in manufacturing facilities or renewable resource systems. Electric cars require them. High-frequency radio equipment counts on them. Clinical imaging gadgets use them. Places requiring exact temperature control benefit.

The combination works. Aluminum nitride handles the insulation and warm transfer. Copper swiftly distributes the heat. Gold guarantees long-lasting dependability and easy setting up. Instruments run cooler. They execute better. They last longer. This innovation supports requiring applications where failing is not an option.

Company Profile

Alumina Technology Co., Ltd,. We focus on the research and development, production and sales of alumina products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2005, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Alumina Boat, Alumina Crucible, Alumina Dish, Alumina Foam Filter, Alumina Plate, Alumina Rod, Alumina Bar, Alumina Balls, Filter Alumina, Nano Alumina Powder, Spherical Alumina Powder, ect. please feel free to contact us.(nanotrun@yahoo.com)

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate

What is Au Coating ALN Ceramic Plate Copper Plating?
This is a special circuit board base. It uses aluminum nitride (ALN) ceramic. Copper is bonded to the ceramic. Then, a thin layer of gold (Au) is applied over the copper. This makes a very strong, heat-managing board.

Why use gold coating on the copper?
Gold protects the copper underneath. Copper can rust or tarnish easily. Gold stops this. Gold also makes soldering components much easier. You get a reliable connection every time. It also works well for wire bonding.

How good is this plate at handling heat?
Aluminum nitride ceramic is excellent for heat. It moves heat away from hot components very fast. This plate moves heat much better than regular fiberglass boards. It works better than aluminum oxide ceramic too. This keeps your electronics cooler and running reliably.

Is this plate tough?
Yes, it is very strong. The ceramic base is hard and resists wear. The copper layer is firmly bonded. The gold coating adds extra protection. This plate handles high temperatures well. It deals with thermal cycling (heating and cooling repeatedly) without failing. It lasts a long time in demanding conditions.

Where is this plate typically used?
You find this plate in high-power electronics needing top heat control. It’s common in power modules for electric cars and trains. It’s used in high-brightness LED lighting systems. Laser diode packages use it. RF and microwave power amplifiers need it. Anywhere heat buildup is a serious problem, this plate helps.

(Au Coating ALN Alumina Nitride Ceramic Plate Copper Plating Substrate)