Overview of Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip

Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip is advanced ceramic components made from high-purity aluminum oxide (Al₂O₃), known for their exceptional hardness, thermal stability, and corrosion resistance. These plates are widely used in demanding industries such as electronics, aerospace, semiconductor manufacturing, and high-temperature furnace applications due to their superior electrical insulation and wear-resistant properties.

Key Features of Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip

High Thermal Resistance ：Withstands extreme temperatures up to 1600°C.

Excellent Electrical Insulation：Ideal for electronic substrates & insulators.

Superior Mechanical Strength：High hardness & wear resistance for long-lasting performance.

Chemical & Corrosion Resistance：Resists acids, alkalis, and harsh environments.

Customizable：Available in various sizes, thicknesses, and purity levels (96%-99.9%).

(Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip)

Specification of Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip

This product is a heavy copper AMB DCB alumina ceramic substrate plate. It is designed for mounting semiconductor chips. The base material is high-purity alumina ceramic. Alumina ceramic is very strong and handles heat well. It also provides good electrical insulation. This insulation stops electrical currents from going where they shouldn’t.

Thick copper layers are bonded directly to both sides of the ceramic base. We use Active Metal Brazing (AMB) or Direct Copper Bonding (DCB) methods. These methods create an incredibly strong bond. The bond between the copper and the ceramic is very reliable. The copper layers are much thicker than standard circuit boards. Copper thicknesses can range from 100 micrometers up to 600 micrometers or more. This heavy copper carries high electrical currents easily. It also spreads heat away from the chip effectively.

This combination offers excellent thermal conductivity. Heat moves quickly from the chip through the copper into the ceramic and out. Good thermal management keeps the chip cooler. A cooler chip performs better and lasts longer. The thick copper also provides low electrical resistance. This means less energy is lost as heat when current flows. High power efficiency is achieved.

These substrates handle high voltages safely. They are mechanically robust. They resist cracking under thermal stress. Temperature changes cause materials to expand and contract. The strong AMB/DCB bond prevents the layers from separating. This ensures long-term reliability in tough conditions.

Typical applications include high-power electronics. You find them in power modules for electric cars, trains, and industrial drives. They are used in renewable energy systems like solar inverters and wind turbines. They serve in high-voltage switchgear and motor controllers. Any application needing robust power handling uses this technology. Chips needing excellent heat dissipation benefit greatly.

(Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip)

Applications of Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip

Heavy copper AMB DCB alumina ceramic substrates are vital for demanding electronics. They combine thick copper layers bonded to a tough alumina base. This structure offers exceptional thermal performance and electrical insulation. These properties are critical for high-power applications. Power semiconductor modules rely heavily on these substrates. IGBTs and MOSFETs generate significant heat. The substrate efficiently pulls this heat away. This prevents overheating and keeps the devices reliable. Electric vehicles use many power electronics. These substrates are found in motor drives and onboard chargers. They handle the high currents and heat in EVs. This helps EVs run efficiently and safely. Renewable energy systems also benefit. Solar inverters and wind turbine converters need robust substrates. Heavy copper AMB DCB alumina handles the power surges. Industrial motor drives face tough conditions. These substrates withstand high temperatures and electrical stress. They ensure factory equipment operates without interruption. RF and microwave power amplifiers use these substrates too. The stable alumina base provides excellent high-frequency performance. Even aerospace and defense applications use them. Their reliability under extreme conditions is essential. Medical imaging equipment demands precision power control. These substrates contribute to stable, high-quality imaging. They are key building blocks for modern power electronics. Their ability to manage heat and electricity makes them irreplaceable.

Company Profile

Alumina Technology Co., Ltd,. We focus on the research and development, production and sales of alumina products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2005, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Alumina Boat, Alumina Crucible, Alumina Dish, Alumina Foam Filter, Alumina Plate, Alumina Rod, Alumina Bar, Alumina Balls, Filter Alumina, Nano Alumina Powder, Spherical Alumina Powder, ect. please feel free to contact us.(nanotrun@yahoo.com)

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip

What is Factory Heavy Copper AMB DCB Alumina ceramic substrate? This substrate is a special kind of ceramic plate. It’s made from alumina. Factories bond thick copper layers onto it. AMB and DCB are two methods for doing this bonding. AMB means Active Metal Brazing. DCB means Direct Copper Bonding. Both methods create a strong bond. The copper layer is much thicker than usual. This allows the plate to handle very high electrical currents. It also helps spread heat away from electronic components efficiently.

Why use heavy copper on these substrates? The heavy copper is key. Thin copper layers can’t carry enough current for demanding uses. They also struggle to move heat away. Heavy copper solves both problems. It lets the substrate manage large power flows. It pulls heat away from sensitive chips fast. This prevents overheating. It keeps components working reliably. This is vital in power electronics. Devices like IGBTs and MOSFETs generate significant heat. They need good thermal management.

What’s the difference between AMB and DCB? AMB and DCB are different bonding techniques. DCB bonds copper directly onto the ceramic. It uses a high-temperature process. This forms a chemical bond. AMB uses a special filler material. It bonds the copper to the ceramic. AMB can sometimes offer better thermal performance. It might handle more heat cycles. The choice depends on the specific application needs. Both methods give strong, reliable bonds.

Where are these substrates used? You find them in high-power electronics. They are common in electric vehicles. They handle power in car systems. They are used in industrial motor drives. They are found in renewable energy systems. Solar inverters and wind power converters use them. Power supplies for servers and telecom equipment rely on them. Any place needing strong power control and heat spreading uses these substrates. They are crucial for modern power devices.

What specs matter for these substrates? Key specifications are important. Copper thickness is critical. Thicker copper carries more current and heat. Thermal conductivity shows how well it moves heat. Higher is better. Dielectric strength indicates electrical insulation quality. Breakdown voltage must be high. The alumina ceramic’s purity affects performance. Higher purity usually means better properties. Flatness and surface finish matter for assembly. Good specs ensure the substrate performs well in tough conditions.

(Factory Heavy Copper AMB DCB Alumina ceramic substrate plate sheet for chip)